Surface Mount Assembly

Engineering

Prototype

Surface Mount Assembly

Conventional Assembly

Box Build

Product Cleanliness and Circuit Protection

Material Management

Inspection & Testing

Shipping

Investment

A large investment in industry leading, state of the art surface mount lines gives Hindley Circuits a market leading capacity to process any size board, at high volume, with absolute accuracy and – if needed – with the agility to achieve quick turnaround.

 

With extensive experience in surface mount assembly, Hindley Circuits operate some of the most advanced equipment in the industry.

Performance & Precision

This includes three fully integrated state of the art surface mount lines, coupled with inline automated inspection, meaning performance and precision is fully optimised.

Capacities & Capabilities

Capacities and Capabilities include:

  • Two lines processing mid to high volume batches – Yamaha YSM/YRM platform
  • One line processing low volume batches Mirae Platform
  • In line Solder paste printers with under-screen clean by DEK and Yamaha
  • Seven zone reflow ovens
  • Overall IPC rated capacity of up to 190,000 components per hour
  • Ability to process boards up to 510mm x 460mm in size
  • Placement from 03015 (metric) to 55mm x 100mm
  • Paste height verification
  • Agitated stencil clean
  • Robust inspection with 3D Automated Optical Inspection Platform

Engineering

Prototype

Surface Mount Assembly

Conventional Assembly

Box Build

Product Cleanliness & Circuit Protection

Material Management

Inspection & Testing

Shipping